Broadcom Inc. is in advanced talks with Apollo Global Management and Blackstone Inc. to secure approximately $35 billion in financing aimed at accelerating its artificial intelligence chip business. This deal would rank among the largest private credit arrangements in the technology sector if it materializes.
The significant funding is intended to support Broadcom’s efforts to develop and produce cutting-edge AI chips designed for data centers and large-scale AI systems. Demand for AI infrastructure continues to grow rapidly as major technology companies intensify investments in machine learning and generative AI technologies.
While the terms of the potential financing package are still under negotiation and could change, neither Broadcom nor the involved investment firms have publicly confirmed the transaction. This move aligns with Broadcom’s recent strategic steps to solidify its role in the AI semiconductor market.
Earlier this year, Broadcom announced a long-term partnership with Google focused on designing and supplying custom tensor processing units (TPUs). The agreement also includes Broadcom providing networking hardware and related components for Google’s next-generation AI rack systems until 2031.
Additionally, Broadcom has expanded its collaboration with Google and AI startup Anthropic, committing to provide Anthropic with access to an extra 3.5 gigawatts of TPU-based AI computing capacity starting in 2027. This arrangement depends on Anthropic’s sustained commercial growth.
The potential financing deal underscores increased investor interest in AI infrastructure. Similar trends emerged last year when Meta Platforms secured nearly $30 billion from Blue Owl Capital and Pacific Investment Management Co. to fund a major data center in Louisiana.
As competition intensifies in the AI chip industry, Broadcom aims to position itself as a key supplier of AI computing systems anticipated to shape the market landscape in 2026 and beyond.